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Medicept BondPlus SE Self Etch Bonding Adhesive

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Simplified ultra-efficient bonding system based on proven ethanol/water solvent technology

Bond Plus SE

  1. • Total etch, less technique sensitive
  2. • Ideal for wet or dry bonding • Reduced post-operative sensitivity

Filler Loaded

  1. • Reduced micro-leakage
  2. • Reduced film thickness
  3. • Increased bond strength

One bottle for ultimate simplicity of use

  1. • Time saving • For direct & indirect applications
  2. • Reliable: clinically proven A GREAT ALL-ROUNDER + ADDED SPEED & SIMPLICITY 7th              GENERATION BONDING ADHESIVE

Core-Technologies

  1. • Optimal filler load (15%)
  2. • Total-Etch • Ethanol/water solvent system

 Available-in 6ml Bottle (7th Generation) 

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