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    Medicept BondPlus SE Self Etch Bonding Adhesive

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    Simplified ultra-efficient bonding system based on proven ethanol/water solvent technology

    Bond Plus SE

    1. • Total etch, less technique sensitive
    2. • Ideal for wet or dry bonding • Reduced post-operative sensitivity

    Filler Loaded

    1. • Reduced micro-leakage
    2. • Reduced film thickness
    3. • Increased bond strength

    One bottle for ultimate simplicity of use

    1. • Time saving • For direct & indirect applications
    2. • Reliable: clinically proven A GREAT ALL-ROUNDER + ADDED SPEED & SIMPLICITY 7th              GENERATION BONDING ADHESIVE

    Core-Technologies

    1. • Optimal filler load (15%)
    2. • Total-Etch • Ethanol/water solvent system

     Available-in 6ml Bottle (7th Generation) 

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