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PENTRON Bond-1 Primer/Adhesive

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Bond-1 Primer/Adhesive is a 5th generation total-etch bonding system that provides high bond strengths in a convenient single bottle application. This versatile system can be used for all your bonding procedures. Bond-1 Primer/Adhesive has been proven to create the ideal sealed surface and interpenetrated network of the polymerized primers and unfilled resin, resulting in a high bond with a low film thickness of only 8µm.

Product Benefits

  • Simple, time-saving and reliable bonding system
  • High bond strength to both dentin and enamel
  • Extremely versatile system - bond direct or indirect, light or chemical cured composites, porcelains, metal restorations and amalgam to tooth structure
  • Low film thickness assures the ideal surface to bond to restorative materials

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